Product Introduction:
On March 20, 2023, the AEC released its latest testing and qualification standard for passive components: AEC-Q200-Rev E: STRESS TEST QUALIFICATION FOR PASSIVE COMPONENTS.
The new standard includes two major changes:
1. The scope of applicable products has expanded from 14 to 16, with the addition of niobium capacitors, fuses, supercapacitors, trimmer resistors, and other products.
Applicable Products: Tantalum capacitors (MnO₂ and polymer) and niobium capacitors, ceramic capacitors, aluminum electrolytic capacitors, film capacitors, electromagnetic (inductors/transformers) , network (R-C/C/R), resistors, thermistors, trimmer capacitors/resistors, varistors, quartz crystals, ceramic resonators, ferrite EMI interference suppressors/filters, polymeric self-resetting fuses, fuses, supercapacitors
II. Redefine the number of test samples based on product size. The new standard uses three specifications—< 10 cm³, 10 cm³ ≤ x ≤ 330 cm³, and >330 cm³. The larger the size, the fewer samples required. Taking temperature cycling as an example, products with a volume <10 cm³ require 77 samples; products with a volume of 10 cm³ ≤ x ≤ 330 cm³ require 26 samples; and products with a volume > 330 cm³ require only 10 samples.
Test Item Classification:
● Testing of Various Parameters: Such as electrical characteristics, appearance, dimensions, transient conductance, short-circuit withstand capability, failure current withstand capability, verification of end-of-life modes, boost start endurance, and sudden load removal endurance, etc.
● Environmental Stress Testing: Conduct stress tests on devices in accordance with environmental adaptability standards for military electronic components and general automotive electronic environmental adaptability standards, such as high-temperature storage, temperature cycling, humidity resistance, elevated humidity, high-temperature operation, thermal shock, surge voltage, salt spray testing, shock, and vibration.
● Process Quality Evaluation: Conduct process quality evaluations of components regarding packaging, subsequent electronic assembly processes, and operational reliability, including DPA, terminal strength, solvent resistance, soldering heat resistance, ESD, solderability, flammability, board bending, beam load, flame retardancy, shear force, etc.
|
Number |
Stress Type |
Comments |
Remarks |
Specified based on product volume (cm³) Minimum quantity per batch |
Batch |
Acceptance Criteria |
|||
|
＜10 |
10≤X≤330 |
＞330 |
Single Product |
Family |
|||||
|
1 |
Electrical Testing Before and After Stress Testing |
G |
General Data |
Unless otherwise specified, all certified devices |
0 Fails |
||||
|
2 |
High-Temperature Exposure (Storage) |
BDGM |
General Data |
77 |
26 |
10 |
1 |
3 |
0 Fails |
|
3 |
Temperature Cycling |
BDGM |
General Data |
77 |
26 |
10 |
1 |
3 |
0 Fails |
|
4 |
Destructive Physical Analysis |
BDG |
General Data |
10 |
5 |
3 |
1 |
3 |
0 Fails |
|
5 |
Humidity Bias |
BDGM |
General Data |
77 |
26 |
10 |
1 |
3 |
0 Fails |
|
6 |
Service Life |
BDGM |
General Data |
77 |
26 |
10 |
1 |
3 |
0 Fails |
|
7 |
Appearance |
GN |
General Data |
All Certified Devices |
0 Fails |
||||
|
8 |
Physical Storage |
GN |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
9 |
Pin Strength |
DGL |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
10 |
Solvent Resistance |
DG |
General Data |
5 |
4 |
3 |
1 |
3 |
0 Fails |
|
11 |
Mechanical Shock |
BDG |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
12 |
Vibration |
BDG |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
13 |
Welding Heat Resistance |
DG |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
14 |
Electrostatic Discharge |
DE |
General Data |
15 |
6 |
3 |
1 |
3 |
0 Fails |
|
15 |
Solderability |
DG |
General Data |
15 per condition |
6 |
3 |
1 |
3 |
0 Fails |
|
16 |
Electrical Characteristics |
GMN |
General Data |
30 |
10 |
4 |
3 |
0 Fails |
|
|
17 |
Flammability |
D |
General Data |
According to Reference Standard |
0 Fails |
||||
|
18 |
Panel Bending |
DS |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
19 |
Lead Strength |
DS |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
20 |
Flame Retardancy |
DG |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
21 |
Rotational Life |
DG |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
22 |
Surge Voltage |
DG |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
23 |
Instantaneous Electrical Conductivity |
DG |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
24 |
Short-Circuit Fault Current Endurance |
DG |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
25 |
Short-Circuit Current Endurance |
DG |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
26 |
End-of-Life Mode Verification |
DG |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
27 |
Startup Durability |
DG |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
|
28 |
Load-Triggered Endurance |
DG |
General Data |
30 |
10 |
4 |
1 |
3 |
0 Fails |
Why Choose Arnool?
To date, Arnool has helped numerous internationally renowned companies obtain AECQ series certification.
Arnool has earned recognition from multiple certification bodies and original equipment manufacturers (OEMs) for its professional technical services.
Certification bodies such as Germany’s TUV Group can provide end-to-end technical services to chip companies, and their relevant capabilities and data have been recognized by TUV, Dekra, and others.