
Product Description: AEC Q101 is a failure-mechanism-based stress testing and qualification standard for discrete semiconductor devices, developed by the AEC Committee. It serves as a comprehensive reliability testing and certification standard for automotive discrete semiconductor devices and represents the basic threshold for the use of discrete semiconductor devices in the automotive industry. First Edition
Product Description:
AEC Q101 is a failure-mechanism-based stress testing and qualification standard for discrete semiconductor devices, developed by the AEC Committee. It serves as a comprehensive reliability testing and certification standard for automotive discrete semiconductor devices and represents the basic threshold for their application in the automotive sector. First published in 1996, it has been continuously updated through the E version released in 2021, which remains the most current standard in use today. The AEC Q101 standard specifies the mandatory test items that discrete semiconductor devices must undergo and pass, based on requirements for product type, package configuration, and sample size.
Applicable Products: Diodes, Zener diodes, voltage-regulating diodes, rectifier diodes, TVS diodes, MOSFETs, IGBTs, etc.
Test Item Categories:
l Parameter Testing: Including performance testing, visual inspection, parameter verification, physical dimensions, thermal resistance, avalanche withstand, short-circuit reliability, dielectric integrity, etc.
l Environmental Stress Testing: Conduct stress tests on devices in accordance with environmental qualification standards for military electronic components and general environmental qualification standards for automotive electronics, such as high-temperature reverse bias, high-temperature gate bias, temperature cycling, high-voltage steam sterilization, HAST, high-temperature and high-humidity reverse bias, high-temperature and high-humidity operation, intermittent operating life, power-temperature cycling, accelerated aging, vibration, shock, airtightness, etc.
l Process Quality Evaluation: Conduct process quality evaluations of components regarding packaging, subsequent electronic assembly processes, and operational reliability, including ESD, DPA, terminal strength, solvent resistance, soldering heat resistance, solderability, wire bonding tensile and shear strength, die push force, lead-free testing, etc.
Test Process

Test Items:
|
No. |
Test Item |
Abbreviation |
|
1 |
Functional Parameters |
TEST |
|
2 |
Pre-treatment |
PC |
|
3 |
Visual Inspection |
EV |
|
4 |
Parameter Verification |
PV |
|
5 |
High-Temperature Reverse Bias |
HTRB |
|
5a |
AC Blocking Voltage |
A CBV |
|
5b |
High-Temperature Forward Bias |
HTFB |
|
5c |
Steady-State Operation |
SSOP |
|
6 |
High-Temperature Gate Bias |
HTGB |
|
7 |
Temperature Cycling |
TC |
|
7a |
Temperature Cycling Heat Test |
TCHT |
|
7alt |
Temperature Cycling Stratification Test |
TCDT |
|
7b |
Wire Bond Integrity |
WBI |
|
8 |
Unbiased Accelerated Stress Test |
UHAST |
|
8alt |
High-Voltage Test |
AC |
|
9 |
High-Acceleration Stress Test |
HAST |
|
9alt |
High-Temperature, High-Humidity Reverse Bias |
H3TRB |
|
9a |
High-Temperature, High-Humidity Forward Bias |
HTHHB |
|
10 |
Intermittent Operating Life |
IOL |
|
10alt |
Power and Temperature Cycling |
PTC |
|
11 |
Electrostatic Discharge Characteristics |
ESD |
|
12 |
Destructive Physical Analysis |
DPA |
|
13 |
Physical Dimensions |
PD |
|
14 |
Terminal Strength |
TS |
|
15 |
Solvent Resistance Constant Acceleration |
RTS |
|
16 |
Constant Acceleration |
CA |
|
17 |
Variable-frequency vibration |
VVF |
|
18 |
Mechanical shock |
MS |
|
19 |
Air Tightness |
HES |
|
20 |
Welding Heat Resistance |
RSH |
|
21 |
Solderability |
SD |
|
22 |
Thermal Resistance |
TR |
|
23 |
Wire-Tie Strength |
WBS |
|
24 |
Wire bonding shear |
BS |
|
25 |
Die Slicing |
DS |
|
26 |
Clamp-Induction Switch |
UIS |
|
27 |
Dielectric Properties |
DI |
|
28 |
Short-Circuit Reliability |
S CR |
|
29 |
Lead-Free |
LF |
Why ChooseArnool?
To date, Arnool has helped numerous internationally renowned companies obtain AECQ series certification.
Arnool has been recognized by numerous certification bodies and original equipment manufacturers (OEMs) for its professional technical services.
Certification bodies such as the German TUV Group provide end-to-end technical services to chip manufacturers, and their relevant capabilities and data have been recognized by organizations such as TUV Dekra.
Arnool testing and certification provides professional, comprehensive analysis services for diodes, Zener diodes, voltage-regulating diodes, rectifier diodes, TVS diodes, MOSFETs, IGBTs, and more. With service capabilities and projects covering global automakers and Tier 1 suppliers, and having established ongoing, close partnerships, Huabi is the ideal partner for AEC-Q testing and certification. Huabi can provide one-stop testing and certification services to automotive-grade discrete device manufacturers:
● Test Plan Development: Define automotive electronics test and certification plans based on product operating conditions and quality metrics;
● Test Plan Development
● Test Fixture Evaluation and Fabrication
● Test Program Development and Debugging
● Failure analysis and improvement recommendations
● Consolidation of AEC-Q101 test reports
● Product certification
● Technical consulting: Providing customized project development, including module components
