Product Overview: AEC-Q100 is a reliability evaluation standard for integrated circuits (ICs) that defines four grades for the operating temperature range. It is used to evaluate automotive semiconductors with high reliability requirements. Typical products include isolators, memory devices, and others. Product Description: AEC-Q100 is based on failure
Product Overview:
AEC-Q100 is a reliability evaluation standard for integrated circuits (ICs) that defines four grades for the operating temperature range. It is used to evaluate automotive semiconductors with high reliability requirements. Typical products include isolators, memory devices, and others.
Product Introduction:
AEC-Q100 is a failure-mechanism-based stress test qualification standard for integrated circuits, developed by the AEC Committee. It serves as a comprehensive reliability testing and certification standard for automotive IC chips and represents the basic threshold for chip products to be used in the automotive sector. The first edition was published in 1995 and has been continuously updated through the H version released in 2014, which remains the current standard in use. The AEC-Q100 standard specifies the mandatory test items that chip products must undergo and pass (based on product type, package configuration, and sampling quantity requirements).
Applicable Products:
Single ICs, such as MCU chips, MPU chips, memory chips, computing chips, security chips, LED driver chips, power management chips, operational amplifiers, comparators, analog chips for sensing, and communication chips.
AEC-Q100 Specifies 41 test items across 7 major categories :
Group A—Accelerated Environmental Stress Testing (PC, THB, HAST, AC, UHST, TH, TC, PTC, HTSL)—6 tests in total
Group B—Accelerated Life Cycle Simulation Testing (HTOL, ELFR, EDR)—3 tests in total
Group C—Package and Assembly Integrity Tests (WBS, WBP, SD, PD, SBS, LI)—6 tests in total
Group D—Chip Manufacturing Reliability Tests (EM, TDDB, HCI, NBTI, SM)—5 tests in total
Group E—Electrical Verification Tests (TEST, FG, HBM/MM, CDM, LU, ED, CHAR, EMC, SC, SER)—11 tests total
Group F—Defect Screening Tests (PAT, SBA)—2 tests total
Group G—Cavity Encapsulation Integrity Tests (MS, VFV, CA, GFL, DROP, LT, DS, IWV)— - 8 tests in total
AEC-Q100 Validation Process
Test Items
|
Group A: Accelerated Environmental Stress Testing |
||
|
No. |
Test Item |
Abbreviation |
|
A1 |
Pre-treatment |
PC |
|
A2 |
Accelerated Stress Test with Skewed Temperature and Humidity or Skewed High-Level Conditions |
THB HAST |
|
A3 |
High-Pressure or Non-Skewed High-Accelerated Stress Test or Non-Skewed Temperature Test |
AC UHST TH |
|
A4 |
Temperature Cycling |
TC |
|
A5 |
Power-Load Temperature Cycling |
PTC |
|
A6 |
High-Temperature Storage Life Test |
HTSL |
|
Group B Accelerated Life Simulation Test |
||
|
No. |
Test Item |
Abbreviation |
|
B1 |
High-Temperature Operating Life |
HTOL |
|
B2 |
Early Life Failure Rate |
ELFR |
|
B3 |
Non-Volatile Memory Endurance |
EDR |
|
Group C: Package Assembly Integrity Test |
||
|
No. |
Test Item |
Abbreviation |
|
C1 |
Wire Bond Shear |
WBS |
|
C2 |
Bond Tensile Strength |
WBP |
|
C3 |
Solderability |
SD |
|
C4 |
Physical Dimensions |
PD |
|
C5 |
Solder Ball Shear |
SBS |
|
C6 |
Lead Integrity |
LI |
|
Group D: Chip and Wafer Reliability Testing |
||
|
No. |
Test Item |
Abbreviation |
|
D1 |
Electromigration |
EM |
|
D2 |
Time-Dependent Dielectric Breakdown |
TDDB |
|
D3 |
Hot Carrier Injection |
HCI |
|
D4 |
Negative Bias Temperature Instability |
NBTI |
|
D5 |
Stress Migration |
SM |
|
Group E: Electrical Characteristic Verification Tests |
||
|
No. |
Test Item |
Abbreviation |
|
E1 |
Functional Parameter Testing Before and After Stress Testing |
TEST |
|
E2 |
Electrostatic Discharge (HBM) |
HBM |
|
E3 |
Electrostatic Discharge (CDM) |
CDM |
|
E4 |
Latch-up Effect |
LU |
|
E5 |
Electrical Distribution |
ED |
|
E6 |
Fault Level |
FG |
|
E7 |
Characteristic Description |
CHAR |
|
E9 |
Electromagnetic Compatibility |
EMC |
|
E10 |
Short-Circuit Characteristics |
SC |
|
E11 |
Soft Error Rate |
SER |
|
E12 |
Lead-Free (Pb) |
LF |
|
Group F Defect Screening Test |
||
|
No. |
Test Item |
Abbreviation |
|
F1 |
Process Average Test |
PAT |
|
F2 |
Statistical Yield Analysis |
SAT |
|
Group G Chamber Sealing Integrity Test |
||
|
No. |
Test Item |
Abbreviation |
|
G1 |
Mechanical Shock |
MS |
|
G2 |
Variable-Frequency Vibration |
VFV |
|
G3 |
Constant Acceleration |
CA |
|
G4 |
Coarse and Fine Air Leak Test |
GFL |
|
G5 |
Packaging Drop Test |
DROP |
|
G6 |
Cover Torque Test |
LT |
|
G7 |
Chip Shear Test |
DS |
|
G8 |
Internal Water Vapor Content Test |
IWV |
Why Choose Arnool?
To date, Arnool has helped numerous internationally renowned companies obtain AECQ series certification.
Arnool has earned recognition from multiple certification bodies and original equipment manufacturers (OEMs) for its professional technical services.
Certification bodies such as Germany’s TUV Group can provide end-to-end technical services to chip manufacturers, and their relevant capabilities and data have been recognized by TUV Dekra and others.